Although there are many wafer inspection systems for process-monitoring, there are few automatic wafer inspection systems for final chip inspection. 虽然目前已经有许多的自动化晶圆检验系统,但是大多都是设计做为制程监控而不是最终产品的检验。
Using this algorithm in the edge measurement of IC chip, the results of the experiments show that this algorithm has good repetitions, its resolution can reach one fortieth pixel, and can fulfil the criterion of industry inspection. 将该算法应用于集成块引脚的边缘检测,实验表明,该算法的重复性很好,分辨率可以达到四十分之一个像素,能够达到工业检测的标准。
An application of line-structured laser in SOP chip pins 'inspection 线结构光在SOP芯片管脚检测中的应用
The application of 8098 single chip microcomputer to the system of displacement measurement and inspection is introduced. 本文介绍了8098单片机在位移监测系统上的应用,较详细地说明了系统的硬件、软件的总体设计,特别是提高系统抗干扰能力的设计。
The method based on tool chip images is a new method for online inspection of tool conditions, and it can overcome the disadvantages of the two aforementioned methods, so it is a promising new method. 基于切屑图像的视觉接监测方法,可以克服前两种方法的缺点,是一种有发展前途的新方法。
This installation uses the M68HC11E9 single chip computer as its core, which can perform control and inspection tasks for various types of units and realize remote control and monitor. 该装置以M68HC11E9单片机为核心,完成多种机型的监测与控制任务,并能实现远程遥控与监测。
Methods: Apply gene chip inspection and bioinformation analytical technique to detect the 96 sorts of signal molecule of MAPK pathway. 方法:运用基因芯片及生物信息分析技术检测分析MAPK信号通路中96种相关信号分子的表达。
Application of Single Chip Processor in Motorbike Inspection 单片机在摩托车检验中的应用
A research on computer vision system of chip inspection by mathematics morphology 将数学形态学应用于检测芯片机器视觉的研究
Features of RGB and HSI color spaces are studied and chip capacitor inspection is realized by utilizing the color feature. 研究了RGB、HSI色彩空间的特点,利用颜色特征实现了贴片电容的缺失的检测。
This article in view of the current CMOS chip manual testing, design of automatic optical inspection system, to meet the requirement of automatic testing for CMOS chip. 本文针对目前CMOS芯片人工检测的不足,设计了自动光学检测系统,满足对CMOS芯片自动检测的要求。
During the chip packaging process, flaw inspection of components is the necessary foundation of correct packaging. 在芯片封装过程中,对芯片引脚的缺陷检测是正确封装的必要基础[1]。
Based on CCD imaging chip, the technology of image acquisition and data transmission is very important in high-performance image stitching and machine vision inspection. 基于CCD成像芯片构建的图像采集与数据传输技术在高性能图像拼接和机器视觉检测中均有着重要的应用价值。
And for underfilled assemblies, application of high frequency ultrasonic microscopy in flip chip inspection was developed. 对于有底充胶的样品,发展了高频超声检测技术在倒装焊接中的应用。